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Low Temperature CMUT Fabrication Process with Dielectric Lift-off Membrane Support for Improved Reliability
This paper reports an improved CMOS compatible low temperature sacrificial layer fabrication process for Capacitive Micromachined Ultrasonic Transducers (CMUTs). The process adds the fabrication step of silicon oxide evaporation which is followed by a lift-off step to define the membrane support are...
Αποθηκεύτηκε σε:
| Τόπος έκδοσης: | J Micromech Microeng |
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| Κύριοι συγγραφείς: | , |
| Μορφή: | Artigo |
| Γλώσσα: | Inglês |
| Έκδοση: |
2018
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| Θέματα: | |
| Διαθέσιμο Online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5958899/ https://ncbi.nlm.nih.gov/pubmed/29785066 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1088/1361-6439/aabe0c |
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