Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials

Many recently developed soft, skin-like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of...

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Detalles Bibliográficos
Publicado en:Adv Funct Mater
Autores principales: Xu, Renxiao, Lee, Jung Woo, Pan, Taisong, Ma, Siyi, Wang, Jiayi, Han, June Hyun, Ma, Yinji, Rogers, John A., Huang, Yonggang
Formato: Artigo
Lenguaje:Inglês
Publicado: 2016
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Article
Acceso en línea:https://ncbi.nlm.nih.gov/pmc/articles/PMC5642935/
https://ncbi.nlm.nih.gov/pubmed/29046624
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adfm.201604545
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