Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials

Many recently developed soft, skin-like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of...

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Detaylı Bibliyografya
Yayımlandı:Adv Funct Mater
Asıl Yazarlar: Xu, Renxiao, Lee, Jung Woo, Pan, Taisong, Ma, Siyi, Wang, Jiayi, Han, June Hyun, Ma, Yinji, Rogers, John A., Huang, Yonggang
Materyal Türü: Artigo
Dil:Inglês
Baskı/Yayın Bilgisi: 2016
Konular:
Article
Online Erişim:https://ncbi.nlm.nih.gov/pmc/articles/PMC5642935/
https://ncbi.nlm.nih.gov/pubmed/29046624
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adfm.201604545
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