Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials

Many recently developed soft, skin-like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of...

Disgrifiad llawn

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Cyhoeddwyd yn:Adv Funct Mater
Prif Awduron: Xu, Renxiao, Lee, Jung Woo, Pan, Taisong, Ma, Siyi, Wang, Jiayi, Han, June Hyun, Ma, Yinji, Rogers, John A., Huang, Yonggang
Fformat: Artigo
Iaith:Inglês
Cyhoeddwyd: 2016
Pynciau:
Article
Mynediad Ar-lein:https://ncbi.nlm.nih.gov/pmc/articles/PMC5642935/
https://ncbi.nlm.nih.gov/pubmed/29046624
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adfm.201604545
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