Загрузка...
Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials
Many recently developed soft, skin-like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of...
Сохранить в:
| Опубликовано в: : | Adv Funct Mater |
|---|---|
| Главные авторы: | , , , , , , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
2016
|
| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5642935/ https://ncbi.nlm.nih.gov/pubmed/29046624 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adfm.201604545 |
| Метки: |
Добавить метку
Нет меток, Требуется 1-ая метка записи!
|