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Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials
Many recently developed soft, skin-like electronics with high performance circuits and low modulus encapsulation materials can accommodate large bending, stretching, and twisting deformations. Their compliant mechanics also allows for intimate, nonintrusive integration to the curvilinear surfaces of...
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| Publicado no: | Adv Funct Mater |
|---|---|
| Main Authors: | , , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5642935/ https://ncbi.nlm.nih.gov/pubmed/29046624 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1002/adfm.201604545 |
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