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A High-Temperature Piezoresistive Pressure Sensor with an Integrated Signal-Conditioning Circuit
This paper focuses on the design and fabrication of a high-temperature piezoresistive pressure sensor with an integrated signal-conditioning circuit, which consists of an encapsulated pressure-sensitive chip, a temperature compensation circuit and a signal-conditioning circuit. A silicon on insulati...
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| Publicado no: | Sensors (Basel) |
|---|---|
| Main Authors: | , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4934339/ https://ncbi.nlm.nih.gov/pubmed/27322288 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s16060913 |
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