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Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer

In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz w...

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Detalhes bibliográficos
Publicado no:Sensors (Basel)
Main Authors: Liang, Jinxing, Zhang, Liyuan, Wang, Ling, Dong, Yuan, Ueda, Toshitsugu
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2015
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC4610569/
https://ncbi.nlm.nih.gov/pubmed/26340632
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s150922049
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