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Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer
In this study, a novel method to assemble a micro-accelerometer by a flip chip bonding technique is proposed and demonstrated. Both the main two parts of the accelerometer, a double-ended tuning fork and a base-proof mass structure, are fabricated using a quartz wet etching process on Z cut quartz w...
שמור ב:
| הוצא לאור ב: | Sensors (Basel) |
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| Main Authors: | , , , , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI
2015
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| נושאים: | |
| גישה מקוונת: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4610569/ https://ncbi.nlm.nih.gov/pubmed/26340632 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s150922049 |
| תגים: |
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