Integration of Trench-Isolated Through-Wafer Interconnects with 2D Capacitive Micromachined Ultrasonic Transducer Arrays

This paper presents a method to provide electrical connection to a 2D capacitive micromachined ultrasonic transducer (CMUT) array. The interconnects are processed after the CMUTs are fabricated on the front side of a silicon wafer. Connections to array elements are made from the back side of the sub...

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Autori principali: Zhuang, Xuefeng, Ergun, Arif S., Huang, Yongli, Wygant, Ira O., Oralkan, Omer, Khuri-Yakub, Butrus T.
Natura: Artigo
Lingua:Inglês
Pubblicazione: 2007
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Article
Accesso online:https://ncbi.nlm.nih.gov/pmc/articles/PMC2084216/
https://ncbi.nlm.nih.gov/pubmed/18037982
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1016/j.sna.2007.04.008
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