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Dislocation reduction in HVPE GaN via high temperature pretreatment of MOCVD-GaN/sapphire substrate

In this paper, decomposition pits on the MOCVD-GaN/sapphire substrate were fabricated by the high temperature pretreatment (HTP) process for the purpose of reducing dislocations in the subsequently grown GaN by hydride vapor phase epitaxy (HVPE). The impact of atmosphere, temperature, and time durin...

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Auteurs principaux: Huihui Wang, Jian Li, Yuan Tian
Format: Artigo
Langue:Inglês
Publié: AIP Publishing LLC 2026-04-01
Collection:AIP Advances
Accès en ligne:https://pubs.aip.org/aip/adv/article-pdf/doi/10.1063/5.0325333/20971783/045215_1_5.0325333.pdf
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