Mounting of microassemblies with silicon substrate
A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered.
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Politekhperiodika
2005-04-01
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| Serie: | Технологія та конструювання в електронній апаратурі |
| Soggetti: | |
| Accesso online: | https://tkea.com.ua/index.php/journal/article/view/1071 |
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