Microassembly on silicon board for accelerometer
The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.
Wedi'i Gadw mewn:
| Prif Awdur: | |
|---|---|
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
Politekhperiodika
2013-10-01
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| Cyfres: | Технологія та конструювання в електронній апаратурі |
| Pynciau: | |
| Mynediad Ar-lein: | https://tkea.com.ua/index.php/journal/article/view/352 |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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