Mounting of microassemblies with silicon substrate
A technology is presented for mounting bare dies with volumetric leads and components in mini-packages onto a silicon board. Several design and technological options for mounting a silicon microassembly onto a metal base are considered.
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
Politekhperiodika
2005-04-01
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| Rangatū: | Технологія та конструювання в електронній апаратурі |
| Ngā marau: | |
| Urunga tuihono: | https://tkea.com.ua/index.php/journal/article/view/1071 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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