Thermal interface materials: From fundamental research to applications

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in...

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Hlavní autoři:	Baojie Wei, Wenmei Luo, Jianying Du, Yafei Ding, Yanjiang Guo, Guimei Zhu, Yuan Zhu, Baowen Li
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	Wiley 2024-12-01
Edice:	SusMat
Témata:	interface structure interfacial thermal resistance thermal conductivity thermal interface materials
On-line přístup:	https://doi.org/10.1002/sus2.239
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