Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface

Abstract Room‐temperature liquid metal has been widely used in electronic packaging due to its high thermal conductivity, but its thermal performance is strongly impeded by the dominated thermal boundary resistance between liquid metal and solid material. Here, first an order‐of‐magnitude reduction...

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Detalhes bibliográficos

Principais autores:	Xudong Zhang, Yuxia Dong, Yanzheng Du, Lei Yang, Weigang Ma, Bingyang Cao
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Wiley-VCH 2025-06-01
coleção:	Advanced Materials Interfaces
Assuntos:	bonding strength electron transport liquid metal thermal conductance thermal interface material
Acesso em linha:	https://doi.org/10.1002/admi.202500041
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