Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface

Abstract Room‐temperature liquid metal has been widely used in electronic packaging due to its high thermal conductivity, but its thermal performance is strongly impeded by the dominated thermal boundary resistance between liquid metal and solid material. Here, first an order‐of‐magnitude reduction...

Descripción completa

Detalles Bibliográficos

Autores principales:	Xudong Zhang, Yuxia Dong, Yanzheng Du, Lei Yang, Weigang Ma, Bingyang Cao
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	Wiley-VCH 2025-06-01
Colección:	Advanced Materials Interfaces
Materias:	bonding strength electron transport liquid metal thermal conductance thermal interface material
Acceso en línea:	https://doi.org/10.1002/admi.202500041
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!