Designing Oxide Fillers for Advanced Thermal Interface Materials: Recent Progress and Future Perspectives

Oxide fillers for thermal interface materials (TIMs) have recently gained attention as reliable heat‐management solutions in advanced electronic packaging. Oxide fillers exhibit balanced performance, with moderate intrinsic thermal conductivity, excellent electrical insulation, processing compatibil...

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Detalhes bibliográficos

Principais autores:	Su‐Jin Ha, Hyun‐Ae Cha, Jong‐Jin Choi, Byung‐Dong Hahn, Cheol‐Woo Ahn, Young Kook Moon
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Wiley-VCH 2026-01-01
Colecção:	Small Structures
Assuntos:	heat dissipation interfacial thermal resistance oxide fillers thermal conductivity thermal interface materials
Acesso em linha:	https://doi.org/10.1002/sstr.202500823
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