Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been developed which need proper characterization. The fol...
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| Autori principali: | , , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
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MDPI AG
2022-01-01
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| Serie: | Metals |
| Soggetti: | |
| Accesso online: | https://www.mdpi.com/2075-4701/12/1/121 |
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