Validation of Heat-Level Vapor Phase Soldering Process and Workspace Leakage Detection with Applied Pressure Sensors
Electronic manufacturing principles are continuously developing, further improving assembly quality and productivity. There is a continuous need to apply novel and improved methods of process monitoring to provide accurate measurement and control during assembling. In this paper, a new principle for...
محفوظ في:
| المؤلفون الرئيسيون: | , , , |
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| التنسيق: | Artigo |
| اللغة: | Inglês |
| منشور في: |
MDPI AG
2021-02-01
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| سلاسل: | Applied Sciences |
| الموضوعات: | |
| الوصول للمادة أونلاين: | https://www.mdpi.com/2076-3417/11/4/1755 |
| الوسوم: |
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