Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
During vapour phase reflow soldering used in electronics manufacturing, the process control of ovens is usually based on temperature measurements, which can be insufficient due to the saturation differences in the temperature and the vapour concentration. Therefore, the ovens use extended cycle time...
Sábháilte in:
| Príomhchruthaitheoirí: | , , , |
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| Formáid: | Artigo |
| Teanga: | Inglês |
| Foilsithe / Cruthaithe: |
Elsevier
2024-05-01
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| Sraith: | Case Studies in Thermal Engineering |
| Ábhair: | |
| Rochtain ar líne: | http://www.sciencedirect.com/science/article/pii/S2214157X24003460 |
| Clibeanna: |
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