Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications

Sn-Ag-Cu-Bi (SAC-Bi) alloys are gaining popularity as a potential replacement for current lead-free solder alloys in microelectronic packages. In this study, the tensile and viscoplastic behaviors of eight SAC-Bi alloys with 0, 1 wt.%, 2 wt.%, and 3 wt.% Bi content were investigated. The samples of...

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Detalhes bibliográficos

Principais autores:	Vishnu Shukla, Omar Ahmed, Peng Su, Tian Tian, Tengfei Jiang
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2024-07-01
Colecção:	Metals
Assuntos:	viscoplasticity Anand viscoplastic model Anand parameters SAC-Bi alloys tensile strength
Acesso em linha:	https://www.mdpi.com/2075-4701/14/7/803
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