In situ study the effects of bias and electric field intensity on electrochemical migration behavior of Sn96.5Ag3.0Cu0.5 solder alloy
In this work, the influence of bias and electric field intensity on the electrochemical migration of SAC305 solder alloy is investigated using a self-designed in-situ thin electrolyte film device. The results indicate that when the bias is 0.5 V, a compact passivation film forms on the sample surfac...
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| Autors principals: | , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2023-11-01
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| Col·lecció: | Journal of Materials Research and Technology |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2238785423028168 |
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