Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints

The development of advanced electronic devices leads to highly miniaturized interconnect circuits (ICs), which significantly increases the electromigration (EM) phenomenon of solder and circuits due to higher current density. The electromigration of solder joints under high current density has becom...

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Autores principales:	Yuanxiang Zhang, Jicheng Zhang, Yong Wang, Yike Fang
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	MDPI AG 2022-06-01
Colección:	Micromachines
Materias:	electromigration microstructure solder bump failure mechanism misorientation angle
Acceso en línea:	https://www.mdpi.com/2072-666X/13/6/953
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