2-step CMP Strategy for Dishing Control of TGV Interposers
Chemical mechanical planarization (CMP) is an essential polishing process in semiconductor manufacturing. Advances in memory technology, including increased capacity and performance, have increased the importance of electronic packaging. In heterogeneous integration, the interposer acts as an import...
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| Hoofdauteurs: | , , , , |
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| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
Korean Society for Precision Engineering
2024-06-01
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| Reeks: | 한국정밀공학회지 |
| Onderwerpen: | |
| Online toegang: | http://www.jkspe.or.kr/upload/pdf/NODE11795937.pdf |
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