Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization
Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically. The surface of the pad, consisting of asperities and pores, underg...
Guardat en:
| Autors principals: | , , , |
|---|---|
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
MDPI AG
2021-02-01
|
| Col·lecció: | Applied Sciences |
| Matèries: | |
| Accés en línia: | https://www.mdpi.com/2076-3417/11/4/1507 |
| Etiquetes: |
Sense etiquetes, Sigues el primer a etiquetar aquest registre!
|