Analysis of Correlation between Pad Temperature and Asperity Angle in Chemical Mechanical Planarization
Chemical mechanical planarization (CMP) is a technology widely employed in device integration and planarization processes used in semiconductor fabrication. In CMP, the polishing pad plays a key role both mechanically and chemically. The surface of the pad, consisting of asperities and pores, underg...
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| Principais autores: | , , , |
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| Format: | Artigo |
| Sprog: | Inglês |
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MDPI AG
2021-02-01
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| Serier: | Applied Sciences |
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| Online adgang: | https://www.mdpi.com/2076-3417/11/4/1507 |
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