Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II
To investigate how the process parameters of ultra-thin diamond grinding wheel dicing affect the dicing quality of silicon carbide (SiC) wafers, single-factor experiments were designed. This study examined the influence of key process parameters, including spindle speed, feed rate, and first dicing...
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| Principais autores: | , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI AG
2026-06-01
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| coleção: | Micromachines |
| Assuntos: | |
| Acesso em linha: | https://www.mdpi.com/2072-666X/17/6/686 |
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