Photonic chiplet interconnection via 3D-nanoprinted interposer
In the past several decades, photonic integrated circuits (PICs) have been investigated using a variety of different waveguide materials and each excels in specific key metrics, such as efficient light emission, low propagation loss, high electro-optic efficiency, and potential for volume production...
Wedi'i Gadw mewn:
| Prif Awduron: | , , , , , |
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| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
Light Publishing Group
2025-01-01
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| Cyfres: | Light: Advanced Manufacturing |
| Pynciau: | |
| Mynediad Ar-lein: | https://www.light-am.com/article/doi/10.37188/lam.2024.046 |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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