Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits
Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current packaging schemes based on suitably polished fiber arrays do not provide sufficient scalability. Alternatively, lithographically-patterned fused...
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| Glavni autori: | , , , , |
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| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
IEEE
2021-01-01
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| Serija: | IEEE Photonics Journal |
| Teme: | |
| Online pristup: | https://ieeexplore.ieee.org/document/9269385/ |
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