Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits

Recent advancements in photonic-electronic integration push towards denser multichannel fiber to silicon photonic chip coupling solutions. However, current packaging schemes based on suitably polished fiber arrays do not provide sufficient scalability. Alternatively, lithographically-patterned fused...

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Bibliografiske detaljer

Principais autores:	A. Desmet, A. Radosavljevic, J. Missinne, D. Van Thourhout, G. Van Steenberge
Format:	Artigo
Sprog:	Inglês
Udgivet:	IEEE 2021-01-01
Serier:	IEEE Photonics Journal
Fag:	Glass interposer integrated photonics photonics packaging ultrafast laser inscription
Online adgang:	https://ieeexplore.ieee.org/document/9269385/
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