Photonic chiplet interconnection via 3D-nanoprinted interposer
In the past several decades, photonic integrated circuits (PICs) have been investigated using a variety of different waveguide materials and each excels in specific key metrics, such as efficient light emission, low propagation loss, high electro-optic efficiency, and potential for volume production...
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| Autori principali: | , , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Light Publishing Group
2025-01-01
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| Serie: | Light: Advanced Manufacturing |
| Soggetti: | |
| Accesso online: | https://www.light-am.com/article/doi/10.37188/lam.2024.046 |
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