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Monolithic 3D Inverter with Interface Charge: Parameter Extraction and Circuit Simulation

We have simulated a monolithic three-dimensional inverter (M3DINV) structure by considering the interfacial trap charges generated thermally during the monolithic three-dimensional integration process. We extracted the SPICE model parameters from M3DINV structures with two types of inter-layer diele...

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Autores principales: Tae Jun Ahn, Sung Kyu Lim, Yun Seop Yu
Formato: Artigo
Lenguaje:Inglês
Publicado: MDPI AG 2021-12-01
Colección:Applied Sciences
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Acceso en línea:https://www.mdpi.com/2076-3417/11/24/12151
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