First-Principles Study of Cu Addition on Mechanical Properties of Ni₃Sn₄-Based Intermetallic Compounds

Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic co...

Täydet tiedot

Bibliografiset tiedot

Päätekijät:	Jinye Yao, Li Wang, Shihao Guo, Xiaofu Li, Xiangxu Chen, Min Shang, Haoran Ma, Haitao Ma
Aineistotyyppi:	Artigo
Kieli:	Inglês
Julkaistu:	MDPI AG 2024-01-01
Sarja:	Metals
Aiheet:	intermetallic compounds first-principles calculations mechanical properties electronic structures
Linkit:	https://www.mdpi.com/2075-4701/14/1/64
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