Código QR (código de barras bidimensional)

First-Principles Study of Cu Addition on Mechanical Properties of Ni<sub>3</sub>Sn<sub>4</sub>-Based Intermetallic Compounds

Ni–Cu under-bump metallisation (UBM) can reduce stress and improve wetting ability in technology for electronic packaging technology advances with three-dimensional integrated circuit (3D IC) devices. The bond between the Sn-based solder and Ni–Cu UBM is affected by the formation of intermetallic co...

ver descrição completa

Na minha lista:
Principais autores: Jinye Yao, Li Wang, Shihao Guo, Xiaofu Li, Xiangxu Chen, Min Shang, Haoran Ma, Haitao Ma
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2024-01-01
coleção:Metals
Assuntos:
intermetallic compounds
first-principles calculations
mechanical properties
electronic structures
Acesso em linha:https://www.mdpi.com/2075-4701/14/1/64
Tags: Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!

Registros relacionados