Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling

In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, whic...

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Bibliografische Detailangaben

Hauptverfasser:	Chun-Chieh Mo, Dinh-Phuc Tran, Jing-Ye Juang, Chih Chen
Format:	Artigo
Sprache:	Inglês
Veröffentlicht:	MDPI AG 2021-07-01
Schriftenreihe:	Metals
Schlagworte:	thermal cycling microbump intermetallic compound 3D-IC packaging
Online-Zugang:	https://www.mdpi.com/2075-4701/11/7/1065
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