Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling

In this study, the effect of intermetallic compound (IMC) bridging on the cracking resistance of microbumps with two different under bump metallization (UBM) systems, Cu/solder/Cu and Cu/solder/Ni, under a thermal cycling test (TCT) is investigated. The height of the Sn2.3Ag solders was ~10 µm, whic...

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Autores principales:	Chun-Chieh Mo, Dinh-Phuc Tran, Jing-Ye Juang, Chih Chen
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	MDPI AG 2021-07-01
Colección:	Metals
Materias:	thermal cycling microbump intermetallic compound 3D-IC packaging
Acceso en línea:	https://www.mdpi.com/2075-4701/11/7/1065
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