Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints
Understanding the failure mechanisms of Pb-free solder joints during thermal cycling is a critical issue in electronic packaging, where solder joints strongly influence device reliability and lifetime. While electron backscatter diffraction (EBSD) has been widely used for this purpose, its destructi...
Gardado en:
| Principais autores: | , , , , |
|---|---|
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
International Union of Crystallography
2026-05-01
|
| Series: | Journal of Synchrotron Radiation |
| Assuntos: | |
| Acceso en liña: | https://journals.iucr.org/paper?S1600577526001475 |
| Tags: |
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!
|