Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints
Understanding the failure mechanisms of Pb-free solder joints during thermal cycling is a critical issue in electronic packaging, where solder joints strongly influence device reliability and lifetime. While electron backscatter diffraction (EBSD) has been widely used for this purpose, its destructi...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
International Union of Crystallography
2026-05-01
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| Col·lecció: | Journal of Synchrotron Radiation |
| Matèries: | |
| Accés en línia: | https://journals.iucr.org/paper?S1600577526001475 |
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