Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints

Understanding the failure mechanisms of Pb-free solder joints during thermal cycling is a critical issue in electronic packaging, where solder joints strongly influence device reliability and lifetime. While electron backscatter diffraction (EBSD) has been widely used for this purpose, its destructi...

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Bibliographic Details

Main Authors:	Jaemyung Kim, Yujiro Hayashi, Hiroaki Tatsumi, Hiroshi Nishikawa, Makina Yabashi
Format:	Artigo
Language:	Inglês
Published:	International Union of Crystallography 2026-05-01
Series:	Journal of Synchrotron Radiation
Subjects:	i-s3dxrd orientation mapping thermal cycling x-ray orientation laminography
Online Access:	https://journals.iucr.org/paper?S1600577526001475
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