Plasma Etching of Aluminum Nitride and Molybdenum in Multidimensional MEMS Structures
ABSTRACT The transition to 3D device architectures is a rapidly advancing trend in microelectronics. As a result, several manufacturing technologies have has to rapidly evolve to meet the challenge of more complex structures, whilst maintaining the high precision needed for functional devices. Curre...
Furkejuvvon:
| Váldodahkkit: | , , |
|---|---|
| Materiálatiipa: | Artigo |
| Giella: | Inglês |
| Almmustuhtton: |
Wiley-VCH
2025-12-01
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| Ráidu: | Advanced Materials Interfaces |
| Fáttát: | |
| Liŋkkat: | https://doi.org/10.1002/admi.202500661 |
| Fáddágilkorat: |
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