Plasma Etching of Aluminum Nitride and Molybdenum in Multidimensional MEMS Structures
ABSTRACT The transition to 3D device architectures is a rapidly advancing trend in microelectronics. As a result, several manufacturing technologies have has to rapidly evolve to meet the challenge of more complex structures, whilst maintaining the high precision needed for functional devices. Curre...
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| Главные авторы: | , , |
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| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
Wiley-VCH
2025-12-01
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| Серии: | Advanced Materials Interfaces |
| Предметы: | |
| Online-ссылка: | https://doi.org/10.1002/admi.202500661 |
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