Mechanical lapping and polishing process of polycrystalline diamond wafers
ObjectivesDiamond is a critical material potentially or already applied in infrared windows, electronic components and acoustic devices for its excellent optical transmittance, high eletron mobility and high breakdown voltage. Mechanical lapping is one of the mainstream methods for diamond planariza...
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| 主要な著者: | , , , , |
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| フォーマット: | Artigo |
| 言語: | Chinês |
| 出版事項: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2025-02-01
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| シリーズ: | Jin'gangshi yu moliao moju gongcheng |
| 主題: | |
| オンライン･アクセス: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2024.0017 |
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