Wafer-Scale Polishing of Polycrystalline MPACVD-Diamond
Diamond offers great potential for use as a thermal spreader in various applications, including power electronics and radio-frequency (RF) applications. However, to be used as an efficient thermal spreader, the atomically smooth surface of the diamond is critical to be bonded with chips. Herein, a p...
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| Principais autores: | , , , , |
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| Format: | Artigo |
| Sprog: | Inglês |
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MDPI AG
2022-02-01
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| Serier: | Surfaces |
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| Online adgang: | https://www.mdpi.com/2571-9637/5/1/8 |
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