Mechanical lapping and polishing process of polycrystalline diamond wafers
ObjectivesDiamond is a critical material potentially or already applied in infrared windows, electronic components and acoustic devices for its excellent optical transmittance, high eletron mobility and high breakdown voltage. Mechanical lapping is one of the mainstream methods for diamond planariza...
Shranjeno v:
| Principais autores: | , , , , |
|---|---|
| Format: | Artigo |
| Jezik: | Chinês |
| Izdano: |
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd.
2025-02-01
|
| Serija: | Jin'gangshi yu moliao moju gongcheng |
| Teme: | |
| Online dostop: | http://www.jgszz.cn/article/doi/10.13394/j.cnki.jgszz.2024.0017 |
| Oznake: |
Brez oznak, prvi označite!
|