Electroless Ni-P deposition on flexible polyimide substrates with tin-palladium nucleation
Abstract The purpose of this study is to report a low-cost electroless deposition (EN) process of Ni-P thin films using a wet-chemical process on flexible polyimide substrate (Kapton® 300HN DuPont™), comprising surface functionalization with NaOH, nucleation with Sn and Pd, and acceleration with HCl...
Сохранить в:
| Главные авторы: | , , , , , |
|---|---|
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
SpringerOpen
2026-02-01
|
| Серии: | Journal of Materials Science: Materials in Engineering |
| Предметы: | |
| Online-ссылка: | https://doi.org/10.1186/s40712-025-00376-8 |
| Метки: |
Нет меток, Требуется 1-ая метка записи!
|