Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper

Various formulations for electroless deposition, to obtain continuous nanometre-sized and micrometre-sized films of palladium on copper, were compared. We deposited ultrathin films using displacement plating formulations. We obtained continuous films with an equivalent thickness between 6 and 22 nm,...

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Detalhes bibliográficos

Principais autores:	Lorenzo Fabbri, Walter Giurlani, Fabio Biffoli, Marco Bellini, Hamish Miller, Claudio Fontanesi, Francesco Vizza, Massimo Innocenti
Formato:	Artigo
Idioma:	Inglês
Publicado em:	MDPI AG 2021-09-01
Colecção:	Applied Sciences
Assuntos:	palladium electroless deposition thin films sustainable catalysts
Acesso em linha:	https://www.mdpi.com/2076-3417/11/18/8403
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