Electroless Ni-P deposition on flexible polyimide substrates with tin-palladium nucleation
Abstract The purpose of this study is to report a low-cost electroless deposition (EN) process of Ni-P thin films using a wet-chemical process on flexible polyimide substrate (Kapton® 300HN DuPont™), comprising surface functionalization with NaOH, nucleation with Sn and Pd, and acceleration with HCl...
Tallennettuna:
| Päätekijät: | , , , , , |
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| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
SpringerOpen
2026-02-01
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| Sarja: | Journal of Materials Science: Materials in Engineering |
| Aiheet: | |
| Linkit: | https://doi.org/10.1186/s40712-025-00376-8 |
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