Research on Substrate Soldering of High-voltage IGBT Modules
It is analyzed physical process and temperature characteristics of vacuum reflow soldering, and also summarized the influence of variables for vacuum reflow soldering process on the quality of IGBT substrate soldering through experiments analysis.
Wedi'i Gadw mewn:
| Prif Awdur: | |
|---|---|
| Fformat: | Artigo |
| Iaith: | Chinês |
| Cyhoeddwyd: |
Editorial Office of Control and Information Technology
2011-01-01
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| Cyfres: | Kongzhi Yu Xinxi Jishu |
| Pynciau: | |
| Mynediad Ar-lein: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.02.001 |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
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