Influence of Substrate on Microvia Structures in Printed Circuit Boards During Reflow
The automotive industry’s increasing dependence on compact electronic packages requires printed circuit boards with robust microvia interconnections. With a focus on minimizing failure rates and reducing costs, automotive manufacturers require that microvia reliability have zero failures. To...
Αποθηκεύτηκε σε:
| Κύριοι συγγραφείς: | , , |
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| Μορφή: | Artigo |
| Γλώσσα: | Inglês |
| Έκδοση: |
IEEE
2023-01-01
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| Σειρά: | IEEE Access |
| Θέματα: | |
| Διαθέσιμο Online: | https://ieeexplore.ieee.org/document/10359520/ |
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