Stress warpage analysis of IGBT module package reflow soldering
In order to explore the impact of reflow soldering process on power device packaging, a 3D package model based on insulated gate bipolar transistor (IGBT) module was established using DesignModeler, and then ANSYS software was used to perform thermal-structural coupling analysis on the IGBT module,...
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| Autores principales: | , , , , |
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| Formato: | Artigo |
| Lenguaje: | Chinês |
| Publicado: |
Editorial Office of Journal of XPU
2021-06-01
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| Colección: | Xi'an Gongcheng Daxue xuebao |
| Materias: | |
| Acceso en línea: | http://journal.xpu.edu.cn/en/#/digest?ArticleID=1058 |
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