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Viscoelastic Warpage and Stress Analysis in SIP Packaging: Numerical simulation and experimental validation

In this study, we use Moldex3D warpage and stress analysis to predict strip warpage by focusing on the PMC process and applying three distinct material models to ensure simulation accuracy, since deformation under high-temperature loading is highly sensitive to material behavior and demands precise...

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Principais autores: Ting-Yu Lee, Yu-Li Chen, Sheng-Jye Hwang, Chun-Yu Ko, Wei-Lun Cheng
Formato: Artigo
Idioma:Inglês
Publicado em: Elsevier 2025-06-01
coleção:Results in Engineering
Assuntos:
System-in-package
Post-mold curing
Compression molding
Warpage
Loading
Viscoelastic
Acesso em linha:http://www.sciencedirect.com/science/article/pii/S2590123025013933
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